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International Microelectronics and Packaging Society, the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Worldwide, IMAPS offers educational and networking opportunities for industry professionals, packaging organizations, and students through technical conferences and workshops, professional development courses, IMAPSource microelectronics packaging research library, and local chapters. Exhibitions market the latest product and service applications of the current technology.
The Society covers a wide-range of technologies and topics critical to microelectronics assembly and packaging, including: on-shoring, heterogeneous integration, fan-out wafer level packaging, 2.5D/3D technologies, system-in-package, photonics/optical, power packaging, CPI, package design/modeling, interconnects, wire bonding, flip chip, MEMS, sensors, packaging for 5g/6g, RF/wireless, signal/power integrity, advanced materials, substrates and more.
IMAPS memberships are available for Corporations, Individuals and Students and provide many valuable benefits: technical, educational and speaking opportunities, networking, event discounts, and the Advancing Microelectronics magazine. For corporations: branding, press releases, discounted advertising, Jobs Marketplace, company listing in Industry Guide, and more.

To all players in the UV/EB industry and their potential clients, the RadTech Europe association is the number one focal point for all reliable and transparent information on our technology, as well as the facilitator that helps members to connect.
RadTech Europe exists to be a focal point in UV/EB technology and to unite players in our industry to further strengthen their market. We want to help everyone understand the true value of UV/EB technology and comprehend its functionality, sustainability and safety.
It is our mission to protect and promote the reputation of UV/EB technology through objective and transparent knowledge sharing. We are here to facilitate discussion and collaboration between the different market players throughout the value chain.

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